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Layer:
6
Surface treatment:
Plating Soft Au
Material:
HL832N
Application:
CPU
Min line width/space:
25um/40um
Special:
FC-BGA
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Layer:
6
Surface treatment:
Plating Soft Au
Material:
HL832N
Application:
SSD
Min line width/space:
30um/30um
Special:
FC-CSP
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Layer:
10
Surface treatment:
ENIG
Material:
S1000-2M+AP8535
Application:
Industrial Communication
Min line width/space:
0.1mm/0.1mm
Special:
10 layers Rigid-Flex design
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Layer:
26
Surface treatment:
ENIG
Material:
PanasonicRF-775+VT901
Application:
Medical
Min line width/space:
0.11mm/0.1mm
Special:
POFV,Backing Drilling,8 layer FCCL
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Layer:
20
Surface treatment:
ENIG
Material:
S1000-2M+AP8535
Application:
3D Power
Min line width/space:
0.1mm/0.1mm
Special:
Steeped Grooves, Depth Control Routing
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Layer:
14
Surface treatment:
ENIG
Material:
S1000-2M+AP8535
Application:
Medical
Min line width/space:
0.15mm/0.15mm
Special:
POFV
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Layer:
8
Surface treatment:
ENIG+Hard Gold
Material:
IT-180A
Application:
ATE Probe Card
Min line width/space:
0.15mm/0.15mm
Special:
4.8mm board thickness, hard gold plating
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Layer:
14
Surface treatment:
ENIG
Material:
PanasonicRF-775+M6G
Application:
Sensor
Min line width/space:
0.075mm/0.075mm
Special:
14 L Anylayer
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Layer:
10
Surface treatment:
ENIG
Material:
S1000-2M+AP8535
Application:
Optical module
Min line width/space:
0.1mm/0.1mm
Special:
Step HDI, Flex layer on outer layer
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Layer:
8
Surface treatment:
ENIG
Material:
PanasonicRF-775+M6G
Application:
Medical
Min line width/space:
0.15mm/0.11mm
Special:
PTH on Flex area, Copper stiffener
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Layer:
4
Surface treatment:
HASL-LF
Material:
S-1000H
Application:
Elevator control board
Min line width/space:
0.15mm/0.11mm
Special:
Heavy Copper,High reliability
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